Magnetic sensor with perpendicular anisotrophy free layer and side shields

ABSTRACT

A tunneling magneto-resistive reader includes a sensor stack separating a top magnetic shield from a bottom magnetic shield. The sensor stack includes a reference magnetic element having a reference magnetization orientation direction and a free magnetic element having a free magnetization orientation direction substantially perpendicular to the reference magnetization orientation direction. A non-magnetic spacer layer separates the reference magnetic element from the free magnetic element. A first side magnetic shield and a second side magnetic shield is disposed between the top magnetic shield from a bottom magnetic shield, and the sensor stack is between the first side magnetic shield and the second side magnetic shield. The first side magnetic shield and the second side magnetic shield electrically insulates the top magnetic shield from a bottom magnetic shield.

RELATED APPLICATION

This application is a continuation of U.S. application Ser. No.12/502,204 filed Jul. 13, 2009. The entire disclosure of thisapplication is incorporated herein by reference.

BACKGROUND

In an electronic data storage and retrieval system, a magnetic recordinghead can include a reader portion having a sensor for retrievingmagnetically encoded information stored on a magnetic medium. Magneticflux from the surface of the medium causes rotation of the magnetizationvector of a sensing layer or layers of the sensor, which in turn causesa change in the electrical properties of the sensor. The sensing layersare often called free layers, since the magnetization vectors of thesensing layers are free to rotate in response to external magnetic flux.The change in the electrical properties of the sensor may be detected bypassing a current through the sensor and measuring a voltage across thesensor. Depending on the geometry of the device, the sense current maybe passed in the plane (CIP) of the layers of the device orperpendicular to the plane (CPP) of the layers of the device. Externalcircuitry then converts the voltage information into an appropriateformat and manipulates that information as necessary to recoverinformation encoded on the disc.

A structure in contemporary magnetic read heads is a thin filmmultilayer structure containing ferromagnetic material that exhibitssome type of magnetoresistance. One magnetoresistive sensorconfiguration includes a multilayered structure formed of a nonmagneticlayer (such as a thin insulating barrier layer or a nonmagnetic metal)positioned between a synthetic antiferromagnet (SAF) and a ferromagneticfree layer, or between two ferromagnetic free layers. The resistance ofthe magnetic sensor depends on the relative orientations of themagnetization of the magnetic layers.

With increased recording densities, the dimensions of the magneticsensor are decreased to sense the magnetic flux of each bit on themagnetic medium. A consequence of decreasing the size of the magneticsensor is preserving the magnetization of the in-plane anisotropy of themagnetic layers of the magnetic sensor. For example, at smallerdimensions, the magnetization of a portion of the free layer may cantaway from the anisotropic magnetization direction to minimizemagnetostatic energy. The relative fraction of the region with cantedmagnetization may increase as the dimensions continue to decrease. Inaddition, changes in the canting direction caused by thermal variationsor external fields may increase noise and instability in the sensor.Furthermore, when a permanent magnet is employed to bias magnetic layersin the magnetic sensor, the magnetization direction of the referencelayer may be tilted off-axis, thereby reducing the signal generated bythe magnetic sensor.

BRIEF SUMMARY

The present disclosure relates to a magnetic sensor with a perpendicularanisotropy free layer and side shields. The present disclosure canimprove the areal density capabilities of a tunneling magneto resistive(TMR) reader.

In an embodiment, a tunneling magneto-resistive reader includes a sensorstack separating a top magnetic shield from a bottom magnetic shield.The sensor stack includes a reference magnetic element having areference magnetization orientation direction and a free magneticelement having a free magnetization orientation direction substantiallyperpendicular to the reference magnetization orientation direction. Anon-magnetic spacer layer separates the reference magnetic element fromthe free magnetic element. A first side magnetic shield and a secondside magnetic shield is disposed between the top magnetic shield from abottom magnetic shield, and the sensor stack is between the first sidemagnetic shield and the second side magnetic shield. The first sidemagnetic shield and the second side magnetic shield electricallyinsulates the top magnetic shield from a bottom magnetic shield.

These and various other features and advantages will be apparent from areading of the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more completely understood in consideration of thefollowing detailed description of various embodiments of the disclosurein connection with the accompanying drawings, in which:

FIG. 1 is a front surface view of a tunneling magneto-resistive (TMR)reader including a free layer assembly having a perpendicular to theplane anisotropy and side shields;

FIG. 2 is a graph showing the resistance across the tunnelingmagneto-resistive (TMR) reader as a function of the magnetic state ofthe free layer element;

FIG. 3 is a front surface view of a tunneling magneto-resistive (TMR)reader including a free layer assembly having a perpendicular to theplane anisotropy and composite side shields;

FIG. 4 is a layer diagram of a composite free layer element;

FIG. 5 is a cross-sectional schematic diagram of a sensor stackincluding a reference magnetic element having a syntheticantiferromagnet and antiferromagnetic layer and a free magnetic elementhaving a perpendicular to the plane anisotropy;

FIG. 6 is a cross-sectional schematic diagram of a sensor stackincluding an extended reference magnetic element having a syntheticantiferromagnet and antiferromagnetic layer and a free magnetic elementhaving a perpendicular to the plane anisotropy;

FIG. 7 is a cross-sectional schematic diagram of a sensor stackincluding an extended reference magnetic element having a pinned layerand antiferromagnetic layer and a free magnetic element having aperpendicular to the plane anisotropy; and

FIG. 8 is a cross-sectional schematic diagram of a sensor stackincluding an extended reference magnetic element having a pinned layerand a hard magnetic layer and a free magnetic element having aperpendicular to the plane anisotropy.

The figures are not necessarily to scale. Like numbers used in thefigures refer to like components. However, it will be understood thatthe use of a number to refer to a component in a given figure is notintended to limit the component in another figure labeled with the samenumber.

DETAILED DESCRIPTION

In the following description, reference is made to the accompanying setof drawings that form a part hereof and in which are shown by way ofillustration several specific embodiments. It is to be understood thatother embodiments are contemplated and may be made without departingfrom the scope or spirit of the present disclosure. The followingdetailed description, therefore, is not to be taken in a limiting sense.The definitions provided herein are to facilitate understanding ofcertain terms used frequently herein and are not meant to limit thescope of the present disclosure.

Unless otherwise indicated, all numbers expressing feature sizes,amounts, and physical properties used in the specification and claimsare to be understood as being modified in all instances by the term“about.” Accordingly, unless indicated to the contrary, the numericalparameters set forth in the foregoing specification and attached claimsare approximations that can vary depending upon the desired propertiessought to be obtained by those skilled in the art utilizing theteachings disclosed herein.

The recitation of numerical ranges by endpoints includes all numberssubsumed within that range (e.g. 1 to 5 includes 1, 1.5, 2, 2.75, 3,3.80, 4, and 5) and any range within that range.

As used in this specification and the appended claims, the singularforms “a”, “an”, and “the” encompass embodiments having pluralreferents, unless the content clearly dictates otherwise. As used inthis specification and the appended claims, the term “or” is generallyemployed in its sense including “and/or” unless the content clearlydictates otherwise.

It is noted that terms such as “top”, “bottom”, “above, “below”, etc.may be used in this disclosure. These terms should not be construed aslimiting the position or orientation of a structure, but should be usedas providing spatial relationship between the structures. Other layers,such as seed or capping layers, are not depicted for clarity but couldbe included as technical need arises.

The present disclosure relates to a magnetic sensor with a perpendicularanisotropy free layer and side shields. The present disclosure canimprove the areal density capabilities of a tunneling magneto resistive(TMR) reader. In addition, a number of sensor stack layer configurationsare described. These sensor stack configurations improve the reader'sperformance. Conventional permanent magnet side shields are eliminatedwith the designs described herein, thus eliminating some magneticasymmetry or canting found in the conventional permanent magnet sideshield designs. While the present disclosure is not so limited, anappreciation of various aspects of the disclosure will be gained througha discussion of the examples provided below.

FIG. 1 is a front surface view of a tunneling magneto-resistive (TMR)reader 10 including a free layer assembly 30 having a perpendicular tothe plane anisotropy and side shields 18, 20. The tunnelingmagneto-resistive (TMR) reader 10 includes a sensor stack 12 separatinga top magnetic shield 14 from a bottom magnetic shield 24. The sensorstack 12 includes a reference magnetic element 34 having a referencemagnetization orientation M_(R) direction a free magnetic element 30having a free magnetization orientation M_(F) direction substantiallyperpendicular to the reference magnetization orientation M_(R)direction, and a non-magnetic spacer 32 layer separating the referencemagnetic element 34 from the free magnetic element 30.

A first side magnetic shield 18 and a second side magnetic shield 20 aredisposed between the top magnetic shield 14 and the bottom magneticshield 24. The sensor stack 12 is between the first side magnetic shield18 and the second side magnetic shield 20, and the first side magneticshield 18 and the second side magnetic shield 20 include an electricallyinsulating layer 19, 21 electrically insulating the top magnetic shield14 from a bottom magnetic shield 24.

In the embodiment shown, free magnetic element 30 is on the top ofsensor stack 12 and reference magnetic element 34 is on the bottom ofsensor stack 12. It will be appreciated that sensor stack 12 mayalternatively include reference magnetic element 34 on the top of sensorstack 12 and free magnetic element 30 on the bottom of sensor stack 12.

Free magnetic element 30 is a single or a composite or multiple layerstructure having a magnetization M_(F) that rotates in response to anexternal magnetic field. Free magnetic element 30 has a magnetizationM_(F) with an effective direction that is perpendicular to the plane ofeach layer of free magnetic element 30 in a quiescent state due to theperpendicular anisotropy of the layer or layers of free magnetic element30. While the direction of magnetization M_(F) in a quiescent state isshown directed toward the top of sensor stack 12, the layer or layers offree magnetic element 30 may alternatively provide an effectivemagnetization direction that is directed toward the bottom of sensorstack 12 in a quiescent state. When free magnetic element 30 hasperpendicular-to-the-plane anisotropy, canting of the magnetizationproximate the edges of the layer or layers of free magnetic element 30is prevented. This reduces noise in sensor stack 12, thereby improvingthe signal generated, and improves the stability of sensor stack 12.

Spacer layer 32 is a nonmagnetic layer disposed between free magneticelement 30 and reference magnetic element 34. In some embodiments,spacer layer 32 is a nonmagnetic, conductive material, such as Cu, Ag,Au, or Ru, making magnetic sensor 10 a giant magnetoresistive sensor. Inother embodiments, spacer layer 32 is a non-magnetic, insulative orsemi-conductive material, such as oxides formed of Mg, Al, Hf, or Ti,making magnetic sensor 10 a tunneling magnetoresistive sensor.

Reference magnetic element 34 has a fixed magnetization direction M_(R)that is in-plane with the layer or layers of magnetic element 34.Magnetization direction M_(F) of free magnetic element 30 isperpendicular to fixed magnetization direction M_(R) in a quiescentstate. Reference magnetic element 34 may be a single ferromagnetic layerhaving an anisotropically defined magnetization direction. Referencemagnetic element 34 may also include various combinations of layers toprovide magnetization M_(R) having a fixed direction, such as aferromagnetic pinned layer with an antiferromagnetic pinning layer, asynthetic ferromagnetic pinned layer (i.e., two ferromagnetic layerscoupled by a nonmagnetic metal, such as Ru), or a syntheticferromagnetic pinned layer coupled to an antiferromagnetic pinninglayer. Ferromagnetic layers of reference layer assembly 34 may be madeof a ferromagnetic alloy, such as CoFe, NiFe, or NiFeCo, and theantiferromagnetic layer may be made of PtMn, IrMn, NiMn, or FeMn. In analternative embodiment, reference magnetic element 34 is replaced by asecond free layer assembly having perpendicular-to-the-plane anisotropy.

In operation, sense current I_(S) is passed through sensor stack 12 vialeads/shields 14 and 24 such that the sense current I_(S) passesperpendicular to the plane of the layer or layers of sensor stack 12. Asmagnetization M_(F) rotates in response to external magnetic fields, theresistance of sensor stack 12 changes as a function of the angle betweenmagnetizations M_(F) and M_(R). The voltage across sensor stack 12 ismeasured between leads/shields 14 and 24 by external circuitry (notshown) to detect changes in resistance of sensor stack 12. The responseof sensor stack 12 to external magnetic fields, and the correspondingchanges in resistance across sensor stack 12, is shown and describedwith regard to FIG. 2.

FIG. 2 is a graph showing the resistance across the tunnelingmagneto-resistive (TMR) reader 12 as a function of the magnetizationorientation M_(F) of the free layer element 30. Layer diagrams 12 a, 12b, and 12 c illustrate the various magnetic states of sensor stack 12 asviewed from the front surface. Layer diagram 12 a illustrates the statesof magnetization M_(F) and magnetization M_(R) in a quiescent state(i.e., no external magnetic field), in which magnetization M_(F) isperpendicular to the plane of free layer element 30. In this state, thereadback voltage across sensor stack 12 is approximately zero.

Layer diagram 12 b illustrates the states of magnetization M_(F) andmagnetization M_(R) when sensor stack 12 is in the presence of anexternal magnetic field having a first direction. The external magneticfield causes magnetization M_(F) to rotate such that magnetization M_(F)is parallel with magnetization M_(R). In this state, the voltage dropacross sensor stack 12 is negative when sense current I_(S) is applied,which is plotted below the zero resistance line in FIG. 2.

Layer diagram 12 c illustrates the states of magnetization M_(F) andmagnetization M_(R) when sensor stack 12 is in the presence of anexternal magnetic field having a second direction opposite the firstdirection. The external magnetic field causes magnetization M_(F) torotate such that magnetization M_(F) is anti-parallel with magnetizationM_(R). In this state, the voltage drop across sensor stack 12 ispositive when sense current I_(S) is applied, which is plotted above thezero resistance line in FIG. 2.

FIG. 3 is a front surface view of a tunneling magneto-resistive (TMR)reader 40 including a free layer assembly having a perpendicular to theplane anisotropy and composite side shields 18, 20. The tunnelingmagneto-resistive (TMR) reader 40 includes a sensor stack 12 separatinga top magnetic shield 14 from a bottom magnetic shield 24. The sensorstack 12 includes a reference magnetic element having a referencemagnetization orientation M_(R) direction a free magnetic element havinga free magnetization orientation M_(F) direction substantiallyperpendicular to the reference magnetization orientation M_(R)direction, and a non-magnetic spacer layer separating the referencemagnetic element from the free magnetic element. As described above.

A first composite side magnetic shield 18 and a second composite sidemagnetic shield 20 are disposed between the top magnetic shield 14 andthe bottom magnetic shield 24. The sensor stack 12 is between the firstcomposite side magnetic shield 18 and the second composite side magneticshield 20, and the first composite side magnetic shield 18 and thesecond composite side magnetic shield 20 include an electricallyinsulating layer 19, 21 electrically insulating the top magnetic shield14 from a bottom magnetic shield 24.

In the embodiment shown the composite side magnetic shields include twoor more layers magnetic layers separated by non-magnetic spacer layers.For example, the first composite side magnetic shield 18 includes afirst magnetic layer 31 and a second magnetic layer 33 separated by anon-magnetic spacer layer 34, and the second composite side magneticshield 20 includes a first magnetic layer 41 and a second magnetic layer43 separated by a non-magnetic spacer layer 44. In some embodiments thenon-magnetic spacer layer 34, 44 is a nonmagnetic, conductive material,such as Cu, Ag, Au, or Ru. In other embodiments, the non-magnetic spacerlayer 34, 44 is a non-magnetic, insulative or semi-conductive material,such as oxides formed of Mg, Al, Hf, or Ti. Non-magnetic, insulative orsemi-conductive the non-magnetic spacer layers 34, 44, assist theelectrically insulating layer 19, 21 in electrically isolating the topmagnetic shield 14 from the bottom magnetic shield 24.

FIG. 4 is a layer diagram of a composite free magnetic element 30. Thefree magnetic elements 30 described herein can be a composite freemagnetic element 30. The composite free magnetic element 30 can includea first layer 35 of CoFeB material and a second layer 36 of TbCoFematerial. There are other materials in addition to the TbCoFe that canbe utilized to provide perpendicular anisotropy. A listing of thesematerials includes FePt, CoPt, Co/Pt multilayers, Co/Pd multilayers,Co/Cu multilayers, Co/Au multilayers, Co/Ni multilayers, and MnAl, forexample. In many embodiments, the first layer 35 is in contact with thespacer layer (32 in FIG. 1) is believed to be responsible for the TMReffect. In addition the TbCoFe material is believed to create theperpendicular anisotropy. A strong exchange coupling between the firstlayer 35 and second layer 36 materials insures that the first layer 35magnetization in the composite free magnetic element 30 is perpendicularto the plane of the composite free magnetic element 30.

FIG. 5 is a cross-sectional schematic diagram of a sensor stack 50including a reference layer having a synthetic antiferromagnet SAF andantiferromagnetic layer 77 and a free magnetic element 30 having aperpendicular to the plane anisotropy. Top and bottom leads/shields 14and 24, free magnetic element 30, spacer layer 32, and referencemagnetic element 74, 75, 76, 77, define front surface 80. In someembodiments, front surface 80 is substantially planar. The front surface80, or air bearing surface (ABS) faces, for example, magnetic media thatis sensed by the sensor stack 50.

In this embodiment, the synthetic antiferromagnet SAF is stabilized bythe antiferromagnetic layer 77. The synthetic antiferromagnet SAF canbe, for example, two ferromagnetic layers 74, 76 coupled by anonmagnetic, electrically conductive spacer layer 75, such as Ru.Ferromagnetic layers of synthetic antiferromagnet SAF can be, forexample, made of a ferromagnetic alloy, such as CoFe, NiFe, or NiFeCo,and the antiferromagnetic layer 77 may be made of PtMn, IrMn, NiMn, orFeMn.

FIG. 6 is a cross-sectional schematic diagram of a sensor stack 51including an extended magnetic reference element 74, 75, 76, 77, havinga synthetic antiferromagnet SAF and antiferromagnetic layer 77 and afree magnetic element 30 having a perpendicular to the plane anisotropy.Top and bottom leads/shields 14 and 24, free magnetic element 30, spacerlayer 32, and reference magnetic element 74, 75, 76, 77, define frontsurface 80. In some embodiments, front surface 80 is substantiallyplanar. The front surface 80, or air bearing surface (ABS) faces, forexample, magnetic media that is sensed by the sensor stack 51.

In this embodiment, the synthetic antiferromagnet SAF is stabilized bythe antiferromagnetic layer 77. The synthetic antiferromagnet SAF canbe, for example, two ferromagnetic layers 74, 76 coupled by anonmagnetic, electrically conductive spacer layer 75, such as Ru.Ferromagnetic layers of synthetic antiferromagnet SAF can be, forexample, made of a ferromagnetic alloy, such as CoFe, NiFe, or NiFeCo,and the antiferromagnetic layer 77 may be made of PtMn, IrMn, NiMn, orFeMn.

In this embodiment, the magnetic reference element 74, 75, 76, 77extends a larger distance away from the front surface than the freemagnetic element 30 having a perpendicular to the plane anisotropy. Inother words, the free magnetic element 30 has a length that is less thanthe length of the magnetic reference element 74, 75, 76, 77. Thisimproves the magnetic stability of the synthetic antiferromagnet SAF.

FIG. 7 is a cross-sectional schematic diagram of a sensor stack 52including an extended reference magnetic element having a pinned layer74 and antiferromagnetic layer 77 and a free magnetic element 30 havinga perpendicular to the plane anisotropy. Top and bottom leads/shields 14and 24, free magnetic element 30, spacer layer 32, and referencemagnetic element 74, 77, define front surface 80. In some embodiments,front surface 80 is substantially planar. The front surface 80, or airbearing surface (ABS) faces, for example, magnetic media that is sensedby the sensor stack 52.

In this embodiment, the magnetic reference element includes a singlepinned layer 74 that has a length that is greater than the length of thefree magnetic element 30. The single pinned layer 74 is stabilized by anantiferromagnetic layer 77. The extended single pinned layer 74 thein-plane magnetic field from the pinned layer acting on the freemagnetic element 30 will be small and will not change its anglesubstantially from the perpendicular direction.

FIG. 8 is a cross-sectional schematic diagram of a sensor stack 53including an extended reference magnetic element having a pinned layer74 and a hard magnetic layer 79 and a free magnetic element 30 having aperpendicular to the plane anisotropy. Top and bottom leads/shields 14and 24, free magnetic element 30, spacer layer 32, and referencemagnetic element 74, 79, define front surface 80. In some embodiments,front surface 80 is substantially planar. The front surface 80, or airbearing surface (ABS) faces, for example, magnetic media that is sensedby the sensor stack 53.

In this embodiment, the magnetic reference element includes a singlepinned layer 74 that has a length that is greater than the length of thefree magnetic element 30. The single pinned layer 74 is stabilized by ahard magnetic layer 79. The extended single pinned layer 74 the in-planemagnetic field from the pinned layer acting on the free magnetic element30 will be small and will not change its angle substantially from theperpendicular direction. The extended single pinned layer 74 can beformed of ferromagnetic material such as, CoFeB for a large TMR, wilethe hard magnetic layer can be formed of materials with a large in-placeHk and Hc like, CoPt, CoCrPt, and/or FePt.

Thus, embodiments of the MAGNETIC SENSOR WITH PERPENDICULAR ANISOTROPYFREE LAYER AND SIDE SHIELDS are disclosed. The implementations describedabove and other implementations are within the scope of the followingclaims. One skilled in the art will appreciate that the presentdisclosure can be practiced with embodiments other than those disclosed.The disclosed embodiments are presented for purposes of illustration andnot limitation, and the present invention is limited only by the claimsthat follow.

1. A magnetic sensor comprising: a sensor stack separating a topmagnetic shield from a bottom magnetic shield, the sensor stackcomprising a reference magnetic element having a reference magnetizationorientation direction and a free magnetic element having a freemagnetization orientation direction substantially perpendicular to thereference magnetization orientation direction, and a non-magnetic spacerlayer separating the reference magnetic element from the free magneticelement; and a first side magnetic shield and a second side magneticshield disposed between the top magnetic shield and the bottom magneticshield, and the sensor stack disposed between the first side magneticshield and the second side magnetic shield, and the first side magneticshield or the second side magnetic shield comprise an electricallyinsulating layer electrically insulating the top magnetic shield fromthe bottom magnetic shield.
 2. A magnetic sensor according to claim 1,wherein the free magnetic element comprises a layer of CoFeB and a layerof TbCoFe, FePt, CoPt, or MnAl.
 3. A magnetic sensor according to claim1, wherein the non-magnetic spacer layer is an oxide material.
 4. Amagnetic sensor according to claim 1, wherein the reference magneticelement comprises a synthetic antiferromagnet stabilized with anantiferromagnetic layer.
 5. A magnetic sensor according to claim 1,wherein the free magnetic layer has a length that is less than a lengthof the reference magnetic element.
 6. A magnetic sensor according toclaim 1, wherein the reference magnetic element comprises a pinned layerstabilized with an antiferromagnetic layer.
 7. A magnetic sensoraccording to claim 6, wherein the free magnetic layer has a length thatis less than a length of the reference magnetic element.
 8. A magneticsensor according to claim 1, wherein the reference magnetic elementcomprises a pinned layer stabilized with a hard magnetic layer.
 9. Amagnetic sensor according to claim 8, wherein the free magnetic layerhas a length that is less than a length of the reference magneticelement.
 10. A magnetic sensor according to claim 8, wherein the pinnedlayer comprises CoFeB and the hard magnetic layer comprises CoPt,CoCrPt, or FePt.
 11. A magnetic sensor according to claim 1, wherein thefirst side magnetic shield and a second side magnetic shield comprise aplurality of magnetic layers separated by non-magnetic spacer layers.12. A magnetic sensor according to claim 1, wherein the non-magneticspacer layers are electrically insulating.
 13. A magnetic sensoraccording to claim 1, wherein the non-magnetic spacer layers areelectrically conducting.
 14. A magnetic sensor comprising: a sensorstack between a top magnetic shield and a bottom magnetic shield, thesensor stack comprising a reference magnetic element having a referencemagnetization orientation direction and a free magnetic element having afree magnetization orientation direction substantially perpendicular tothe reference magnetization orientation direction, and a non-magneticspacer layer separating the reference magnetic element from the freemagnetic element; a first side magnetic shield and a second sidemagnetic shield separating the top magnetic shield from the bottommagnetic shield, and the sensor stack between the first side magneticshield and the second side magnetic shield, and the first side magneticshield or the second side magnetic shield comprise two or more magneticlayers separated by a spacer layer; and an electrically insulating layerseparates the first side magnetic shield or the second side magneticshield from the top magnetic shield and the bottom magnetic shield. 15.A magnetic sensor according to claim 14, wherein the non-magnetic spacerlayers are electrically insulating.
 16. A magnetic sensor according toclaim 14, wherein the non-magnetic spacer layers are electricallyconducting.
 17. A magnetic sensor according to claim 14, wherein thefree magnetic layer has a length that is less than a length of thereference magnetic element.
 18. A magnetic sensor comprising: a sensorstack between a top magnetic shield and a bottom magnetic shield, thesensor stack comprising a reference magnetic element having a referencemagnetization orientation direction and a free magnetic element having afree magnetization orientation direction substantially perpendicular tothe reference magnetization orientation direction, and a non-magneticspacer layer separating the reference magnetic element from the freemagnetic element, the reference magnetic element comprising two or moremagnetic layers; and a first side magnetic shield and a second sidemagnetic shield separating the top magnetic shield from a bottommagnetic shield, the sensor stack disposed between the first sidemagnetic shield and the second side magnetic shield, and the first sidemagnetic shield or the second side magnetic shield comprise two or moremagnetic layers separated by spacer layer; and an electricallyinsulating layer separates the first side magnetic shield or the secondside magnetic shield from the top magnetic shield and the bottommagnetic shield.
 19. A magnetic sensor according to claim 18, whereinthe reference magnetic element comprises a synthetic antiferromagnetstabilized with an antiferromagnetic layer.
 20. A magnetic sensoraccording to claim 18, wherein the reference magnetic element comprisesa pinned layer stabilized with a hard magnetic layer.